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- Manufacturer No：CY7C2263KV18-550BZXC
- Manufacturer：Cypress Semiconductor Corp
- Category：Memory
- Datasheet：CY7C2263KV18-550BZXC
- SKU：3826185
- Description：e1 Surface Mount CY7C2263 Tray ic memory 550MHz 0.45ns 15mm 36Mb
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CY7C2263KV18-550BZXC Details
e1 Surface Mount CY7C2263 Tray ic memory 550MHz 0.45ns 15mm 36Mb
CY7C2263KV18-550BZXC Specification Parameters
- Part Status: Active
- Number of Ports: 2
- Number of Functions: 1
- Surface Mount: YES
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Supply Voltage: 1.8V
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Published: 2003
- Height Seated (Max): 1.4mm
- Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
- Memory Type: Volatile
- Supply Voltage-Min (Vsup): 1.7V
- Number of Pins: 165
- Voltage - Supply: 1.7V~1.9V
- Package / Case: 165-LBGA
- Clock Frequency: 550MHz
- Access Time (Max): 0.45 ns
- Memory Size: 36Mb 2M x 18
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Radiation Hardening: No
- Packaging: Tray
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Factory Lead Time: 13 Weeks
- Operating Supply Voltage: 1.8V
- Memory Width: 18
- Memory Interface: Parallel
- JESD-609 Code: e1
- Operating Temperature: 0°C~70°C TA
- Length: 15mm
- Memory Format: SRAM
- Supply Voltage-Max (Vsup): 1.9V
- Number of Terminations: 165
- Additional Feature: PIPELINED ARCHITECTURE
- Address Bus Width: 19b
- Density: 36 Mb
- Technology: SRAM - Synchronous, QDR II+
- Base Part Number: CY7C2263
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Cypress Semiconductor Corp — Manufacturer Introduction
Cypress targets innovative markets growing faster than the overall semiconductor industry, including key segments of the automotive, industrial, home automation and appliances, medical products and consumer electronics businesses. With the help of Digi-Key Electronics, we supply customers with market-leading solutions based on our MCUs, wireless SoCs, memories, analog ICs and USB controllers. Our world-class wireless technology gives us an unparalleled position in the fast-growing Internet of Things, a business that cuts across our conventional markets and gives us a stake in exciting, next-generation segments such as connected and autonomous cars.
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