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  • Manufacturer No:
    JS28F512P33EFA
  • Manufacturer:
  • Category:
    Memory
  • Datasheet:
    Get the PDF file
  • SKU:
    3921534
  • Description:
    e3 Surface Mount 28F512P33 Tray ic memory 40MHz 105ns 14.2mm 31mA
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  • Manufacturer No:
    JS28F512P33EFA
  • Manufacturer:
    Micron Technology Inc.
  • Category:
    Memory
  • Datasheet:
    JS28F512P33EFA
  • SKU:
    3921534
  • Description:
    e3 Surface Mount 28F512P33 Tray ic memory 40MHz 105ns 14.2mm 31mA

JS28F512P33EFA Details

e3 Surface Mount 28F512P33 Tray ic memory 40MHz 105ns 14.2mm 31mA

JS28F512P33EFA Specification Parameters

  • RoHS Status: ROHS3 Compliant
  • Number of Functions: 1
  • Radiation Hardening: No
  • JESD-609 Code: e3
  • Part Status: Obsolete
  • Packaging: Tray
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 30
  • Published: 2010
  • Terminal Pitch: 0.5mm
  • Memory Interface: Parallel
  • Number of Pins: 56
  • Memory Type: Non-Volatile
  • Nominal Supply Current: 31mA
  • Voltage: 2.3V
  • Technology: FLASH - NOR
  • Width: 14.2mm
  • Memory Size: 512Mb 32M x 16
  • Length: 18.6mm
  • Density: 512 Mb
  • Write Cycle Time - Word, Page: 105ns
  • Address Bus Width: 25b
  • Base Part Number: 28F512P33
  • Mounting Type: Surface Mount
  • Pbfree Code: yes
  • Surface Mount: YES
  • Contact Plating: Tin
  • Terminal Position: DUAL
  • REACH SVHC: No SVHC
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Supply Voltage: 3V
  • Operating Temperature: -40°C~85°C TA
  • Memory Format: FLASH
  • Number of Terminations: 56
  • Pin Count: 56
  • Clock Frequency: 40MHz
  • Word Size: 16b
  • Sync/Async: Asynchronous
  • Voltage - Supply: 2.3V~3.6V
  • Interface: Parallel, Serial
  • Package / Case: 56-TFSOP (0.724, 18.40mm Width)
  • Organization: 32MX16
  • Access Time (Max): 105 ns
  • Series: Axcell?
  • Height: 1.03mm

Micron Technology Inc. — Manufacturer Introduction

In 1978, Micron Technology Co., Ltd. was established. Is one of the world's largest semiconductor storage and imaging products manufacturers, its main products include DRAM, NAND flash memory, NOR flash memory, SSD solid state drives and CMOS image sensors, the head office (Micron Technology, Inc.) is located in Boise, the capital of Idaho in the northwest of the United States.

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