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- Manufacturer No：MTFC8GAKAJCN-4M IT
- Manufacturer：Micron
- Category：Memory
- Datasheet：MTFC8GAKAJCN-4M IT
- SKU：3923292
- Description：Active 2002 BOTTOM Non-Volatile ic memory 190MBps -40C~85C TA 2.7V~3.6V 64Gb 8G x 8
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MTFC8GAKAJCN-4M IT Details
Active 2002 BOTTOM Non-Volatile ic memory 190MBps -40C~85C TA 2.7V~3.6V 64Gb 8G x 8
MTFC8GAKAJCN-4M IT Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- External Data Bus Width: 8
- Packaging: Tray
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Operating Temperature: -40°C~85°C TA
- Height Seated (Max): 1mm
- Published: 2002
- JESD-609 Code: e1
- Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
- Voltage - Supply: 2.7V~3.6V
- Width: 11.5mm
- Memory Interface: MMC
- Series: e?MMC?
- Package / Case: 153-VFBGA
- Host Data Transfer Rate-Max: 190 MBps
- RoHS Status: ROHS3 Compliant
- Surface Mount: YES
- Factory Lead Time: 12 Weeks
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 0.5mm
- Memory Format: FLASH
- Terminal Position: BOTTOM
- Memory Type: Non-Volatile
- HTS Code: 8542.31.00.01
- Length: 13mm
- Technology: FLASH - NAND
- Number of Terminations: 153
- Memory Size: 64Gb 8G x 8
- JESD-30 Code: R-PBGA-B153
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Micron — Manufacturer Introduction
Micron Technology is a world leader in innovative memory solutions that transform how theworld uses Information. Through our global brands - Micron, Crucial and Ballistix - weoffer the industry's broadest portfolio, and are the only company that manufactures today'smajor memory and storage technologies: DRAM, NAND, NOR, and 3D XPoint memory.
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