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  • Manufacturer No:
    A1460A-PQ160I
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    A1460A-PQ160I
  • SKU:
    3929159
  • Description:
    ACT™ 3 A1460 160-BQFP TIN LEAD field programmable gate array 4.1mm 5V 100MHz 3ns

A1460A-PQ160I Details

ACT™ 3 A1460 160-BQFP TIN LEAD field programmable gate array 4.1mm 5V 100MHz 3ns

A1460A-PQ160I Specification Parameters

  • Mounting Type: Surface Mount
  • Radiation Hardening: No
  • Part Status: Obsolete
  • Operating Supply Voltage: 5V
  • JESD-609 Code: e0
  • Technology: CMOS
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Operating Temperature: -40°C~85°C TA
  • HTS Code: 8542.39.00.01
  • Frequency: 100MHz
  • Voltage - Supply: 4.5V~5.5V
  • Peak Reflow Temperature (Cel): 225
  • Width: 28mm
  • Number of Pins: 160
  • Propagation Delay: 3 ns
  • Number of Registers: 768
  • Package / Case: 160-BQFP
  • Number of I/O: 131
  • Number of Logic Elements/Cells: 848
  • Mount: Surface Mount
  • RoHS Status: Non-RoHS Compliant
  • Supply Voltage: 5V
  • Packaging: Tray
  • Terminal Form: GULL WING
  • Published: 2012
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Position: QUAD
  • Terminal Pitch: 0.65mm
  • Terminal Finish: TIN LEAD
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Length: 28mm
  • Number of Terminations: 160
  • Height Seated (Max): 4.1mm
  • Turn On Delay Time: 3 ns
  • Number of Gates: 6000
  • Series: ACT? 3
  • Number of CLBs: 848
  • Base Part Number: A1460

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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