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- Manufacturer No：MT48LC8M16A2TG-75:G
- Manufacturer：Micron
- Category：Memory
- Datasheet：MT48LC8M16A2TG-75:G
- SKU：3933063
- Description：EAR99 Surface Mount MT48LC8M16A2 Tray ic memory 133MHz 5.4ns 22.22mm 150mA
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MT48LC8M16A2TG-75:G Details
EAR99 Surface Mount MT48LC8M16A2 Tray ic memory 133MHz 5.4ns 22.22mm 150mA
MT48LC8M16A2TG-75:G Specification Parameters
- Mounting Type: Surface Mount
- Number of Functions: 1
- ECCN Code: EAR99
- RoHS Status: Non-RoHS Compliant
- Terminal Position: DUAL
- Operating Supply Voltage: 3.3V
- Lead Free: Contains Lead
- Memory Width: 16
- Supply Voltage-Min (Vsup): 3V
- Published: 2009
- Terminal Pitch: 0.8mm
- Moisture Sensitivity Level (MSL): 2 (1 Year)
- Nominal Supply Current: 150mA
- Output Characteristics: 3-STATE
- Voltage - Supply: 3V~3.6V
- Number of Pins: 54
- Data Bus Width: 16b
- Clock Frequency: 133MHz
- Memory Format: DRAM
- Refresh Cycles: 4096
- Technology: SDRAM
- Length: 22.22mm
- Interleaved Burst Length: 1248
- Package / Case: 54-TSOP (0.400, 10.16mm Width)
- Density: 128 Mb
- Organization: 8MX16
- Mount: Surface Mount
- Number of Ports: 1
- Radiation Hardening: No
- Part Status: Obsolete
- Supply Voltage: 3.3V
- Packaging: Tray
- JESD-609 Code: e0
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Finish: Tin/Lead (Sn/Pb)
- Supply Voltage-Max (Vsup): 3.6V
- Memory Interface: Parallel
- Height Seated (Max): 1.2mm
- Operating Temperature: 0°C~70°C TA
- Memory Type: Volatile
- Number of Terminations: 54
- Pin Count: 54
- I/O Type: COMMON
- Peak Reflow Temperature (Cel): 235
- Write Cycle Time - Word, Page: 15ns
- Additional Feature: AUTO/SELF REFRESH
- Access Time: 5.4ns
- Standby Current-Max: 0.002A
- Sequential Burst Length: 1248FP
- Address Bus Width: 14b
- Memory Size: 128Mb 8M x 16
- Base Part Number: MT48LC8M16A2
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Micron — Manufacturer Introduction
Micron Technology is a world leader in innovative memory solutions that transform how theworld uses Information. Through our global brands - Micron, Crucial and Ballistix - weoffer the industry's broadest portfolio, and are the only company that manufactures today'smajor memory and storage technologies: DRAM, NAND, NOR, and 3D XPoint memory.
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