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A54SX32A-TQG176I
  • Manufacturer No:
    A54SX32A-TQG176I
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    A54SX32A-TQG176I
  • SKU:
    3936979
  • Description:
    SX-A A54SX32A 176-LQFP Surface Mount field programmable gate array 1.4mm 2.75V 238MHz 1.2ns

A54SX32A-TQG176I Details

SX-A A54SX32A 176-LQFP Surface Mount field programmable gate array 1.4mm 2.75V 238MHz 1.2ns

A54SX32A-TQG176I Specification Parameters

  • Mounting Type: Surface Mount
  • RoHS Status: RoHS Compliant
  • Lead Free: Lead Free
  • Packaging: Tray
  • Max Operating Temperature: 85°C
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Operating Temperature: -40°C~85°C TA
  • Min Supply Voltage: 2.25V
  • Width: 24mm
  • Number of Pins: 176
  • Number of I/O: 147
  • Number of LABs/CLBs: 2880
  • Series: SX-A
  • Voltage - Supply: 2.25V~5.25V
  • Turn On Delay Time: 1.2 ns
  • Number of Registers: 1980
  • Frequency: 238MHz
  • Mount: Surface Mount
  • Radiation Hardening: No
  • Part Status: Obsolete
  • Min Operating Temperature: -40°C
  • Operating Supply Voltage: 2.5V
  • Published: 2007
  • Height: 1.4mm
  • Length: 24mm
  • Max Supply Voltage: 2.75V
  • Package / Case: 176-LQFP
  • Number of Logic Elements/Cells: 2880
  • Number of Logic Blocks (LABs): 2880
  • Number of Gates: 48000
  • Propagation Delay: 1.2 ns
  • Base Part Number: A54SX32A
  • Max Frequency: 238MHz
  • Supplier Device Package: 176-TQFP (24x24)

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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