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- Manufacturer No：M27C160-100F1
- Manufacturer：STMicroelectronics
- Category：Memory
- Datasheet：M27C160-100F1
- SKU：4541314
- Description：EAR99 Through Hole M27C160 Tube ic memory 100ns 15.24mm 70mA 16Mb
User Guide
User Guide
M27C160-100F1 Details
EAR99 Through Hole M27C160 Tube ic memory 100ns 15.24mm 70mA 16Mb
M27C160-100F1 Specification Parameters
- RoHS Status: ROHS3 Compliant
- Mount: Through Hole
- ECCN Code: EAR99
- JESD-609 Code: e3
- Part Status: Obsolete
- Terminal Position: DUAL
- Operating Supply Voltage: 5V
- Packaging: Tube
- Terminal Pitch: 2.54mm
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Voltage - Supply: 4.5V~5.5V
- Memory Type: Non-Volatile
- Number of Pins: 42
- Pin Count: 42
- Nominal Supply Current: 70mA
- Width: 15.24mm
- Access Time: 100ns
- Organization: 1MX16
- Height Seated (Max): 5.71mm
- Technology: EPROM - UV
- Length: 54.635mm
- Additional Feature: USER CONFIGURABLE AS 1M X 16
- Mounting Type: Through Hole
- Number of Functions: 1
- Radiation Hardening: No
- Lead Free: Lead Free
- Alternate Memory Width: 8
- Supply Voltage: 5V
- Power Supplies: 5V
- Memory Width: 16
- Terminal Finish: Matte Tin (Sn)
- Memory Interface: Parallel
- Operating Temperature: 0°C~70°C TA
- Output Characteristics: 3-STATE
- Number of Terminations: 42
- Peak Reflow Temperature (Cel): 245
- I/O Type: COMMON
- Memory Format: EPROM
- Standby Current-Max: 0.0001A
- Density: 16 Mb
- Memory Size: 16Mb 2M x 8 1M x 16
- Package / Case: 42-CDIP (0.600, 15.24mm) Window
- Base Part Number: M27C160
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STMicroelectronics — Manufacturer Introduction
STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.
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