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- Manufacturer No：BUB941ZTT4
- Manufacturer：STMicroelectronics
- Category：Transistors - Bipolar (BJT) - Single
- Datasheet：BUB941ZTT4
- SKU：4566743
- Description：BUB941ZT Series 350 V 15 A 150 W SMT NPN Power Darlington Transistor - D2PAK
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User Guide
BUB941ZTT4 Details
BUB941ZT Series 350 V 15 A 150 W SMT NPN Power Darlington Transistor - D2PAK
BUB941ZTT4 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Emitter Base Voltage (VEBO): 5V
- Pin Count: 4
- Number of Pins: 3
- Time@Peak Reflow Temperature-Max (s): 30
- Transistor Element Material: SILICON
- Series: Automotive
- Max Collector Current: 15A
- Max Power Dissipation: 150W
- Voltage - Rated DC: 350V
- Collector Emitter Breakdown Voltage: 350V
- Polarity: NPN
- Current - Collector Cutoff (Max): 100μA
- JESD-30 Code: R-PSSO-G2
- Transistor Application: AMPLIFIER
- hFE Min: 300
- Operating Temperature: 175°C TJ
- Vce Saturation (Max) @ Ib, Ic: 1.8V @ 250mA, 10A
- RoHS Status: ROHS3 Compliant
- Number of Terminations: 2
- Mount: Surface Mount
- Number of Elements: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Contact Plating: Tin
- Collector Base Voltage (VCBO): 5V
- Factory Lead Time: 8 Weeks
- Terminal Form: GULL WING
- Collector Emitter Saturation Voltage: 1.8V
- Element Configuration: Single
- Current Rating: 15A
- Continuous Collector Current: 15A
- Power Dissipation: 150W
- Collector Emitter Voltage (VCEO): 350V
- Max Breakdown Voltage: 350V
- Peak Reflow Temperature (Cel): 245
- Subcategory: Other Transistors
- Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Case Connection: COLLECTOR
- Transistor Type: NPN - Darlington
- DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 5A 10V
- Base Part Number: BUB941
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STMicroelectronics — Manufacturer Introduction
STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.
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