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- Manufacturer No：STTH30L06G
- Manufacturer：STMicroelectronics
- Category：Diodes - Rectifiers - Single
- Datasheet：STTH30L06G
- SKU：4574203
- Description：DIODE GEN PURP 600V 30A D2PAK
User Guide
User Guide
STTH30L06G Details
DIODE GEN PURP 600V 30A D2PAK
STTH30L06G Specification Parameters
- RoHS Status: ROHS3 Compliant
- Number of Terminations: 2
- Mount: Surface Mount
- Number of Phases: 1
- JESD-609 Code: e3
- Part Status: Obsolete
- Number of Pins: 3
- Qualification Status: Not Qualified
- Min Operating Temperature: -65°C
- Reach Compliance Code: not_compliant
- Diode Element Material: SILICON
- Voltage - Rated DC: 600V
- Max Repetitive Reverse Voltage (Vrrm): 600V
- Terminal Position: SINGLE
- Current Rating: 30A
- Output Current: 30A
- HTS Code: 8541.10.00.80
- Forward Current: 50A
- JESD-30 Code: R-PSSO-G2
- Case Connection: CATHODE
- Element Configuration: Common Anode
- Peak Reverse Current: 25μA
- Recovery Time: 90 ns
- Max Forward Surge Current (Ifsm): 160A
- Width: 9.35mm
- Current - Reverse Leakage @ Vr: 25μA @ 600V
- Voltage - Forward (Vf) (Max) @ If: 1.55V @ 30A
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Lead Free: Lead Free
- Packaging: Tube
- Pin Count: 3
- Terminal Form: GULL WING
- Time@Peak Reflow Temperature-Max (s): 30
- Max Operating Temperature: 175°C
- Diode Type: Standard
- Max Reverse Voltage (DC): 600V
- Reverse Voltage: 600V
- Speed: Fast Recovery =< 500ns, > 200mA (Io)
- Average Rectified Current: 30A
- Terminal Finish: Matte Tin (Sn) - annealed
- Peak Reflow Temperature (Cel): 245
- Subcategory: Rectifier Diodes
- Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Height: 4.6mm
- Length: 10.4mm
- Reverse Recovery Time: 90 ns
- Max Surge Current: 160A
- Operating Temperature - Junction: 175°C Max
- Application: HIGH VOLTAGE ULTRA FAST RECOVERY
- Base Part Number: STTH30
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STMicroelectronics — Manufacturer Introduction
STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.
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