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- Manufacturer No：ST72F262G2M6
- Manufacturer：STMicroelectronics
- Category：Embedded - Microcontrollers
- Datasheet：ST72F262G2M6
- SKU：4579558
- Description：8-bit Microcontrollers - MCU Flash 8K SPI/I2C/SCI
User Guide
User Guide
ST72F262G2M6 Details
8-bit Microcontrollers - MCU Flash 8K SPI/I2C/SCI
ST72F262G2M6 Specification Parameters
- DMA Channels: NO
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Radiation Hardening: No
- PWM Channels: YES
- Part Status: Obsolete
- Bit Size: 8
- Terminal Position: DUAL
- Packaging: Tube
- Terminal Form: GULL WING
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s): 30
- Max Power Dissipation: 500mW
- Operating Temperature: -40°C~85°C TA
- Number of Pins: 28
- Program Memory Type: FLASH
- Oscillator Type: Internal
- Subcategory: Microcontrollers
- Voltage - Supply (Vcc/Vdd): 2.7V~5.5V
- uPs/uCs/Peripheral ICs Type: MICROCONTROLLER
- Frequency: 8MHz
- Peak Reflow Temperature (Cel): 250
- Peripherals: LVD, POR, PWM, WDT
- Speed: 16 MHz
- Supply Current-Max: 11mA
- Program Memory Size: 8KB 8K x 8
- Data Converter: A/D 6x10b
- Series: ST7
- DAC Channels: NO
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Has ADC: YES
- Lead Free: Lead Free
- JESD-609 Code: e4
- On Chip Program ROM Width: 8
- Supply Voltage: 5V
- Number of Timers/Counters: 3
- Technology: CMOS
- Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
- Supply Voltage-Max (Vsup): 5.5V
- Terminal Pitch: 1.27mm
- Number of Terminations: 28
- Pin Count: 28
- Number of I/O: 22
- Connectivity: SPI
- Core Size: 8-Bit
- Data Bus Width: 8b
- Height Seated (Max): 2.65mm
- RAM Size: 256 x 8
- Package / Case: 28-SOIC (0.295, 7.50mm Width)
- ROM (words): 8192
- Memory Size: 8kB
- Length: 17.9mm
- Interface: I2C, SCI, SPI
- Access Time: 16 μs
- Base Part Number: ST72F26
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STMicroelectronics — Manufacturer Introduction
STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.
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