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  • Manufacturer No:
    XC7A12T-1CSG325C
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    Get the PDF file
  • SKU:
    5164056
  • Description:
    Artix-7 324-LFBGA CSPBGA Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 1.5mm 1V 720kB 0C~85C TJ
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  • Qty Unit Price price
  • 1 $43.27 $43.27
  • 10 $42.841 $428.41
  • 100 $42.416 $4241.6
  • 1000 $41.996 $41996
  • 10000 $41.58 $415800

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  • Manufacturer No:
    XC7A12T-1CSG325C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC7A12T-1CSG325C
  • SKU:
    5164056
  • Description:
    Artix-7 324-LFBGA CSPBGA Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 1.5mm 1V 720kB 0C~85C TJ

XC7A12T-1CSG325C Details

Artix-7 324-LFBGA CSPBGA Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 1.5mm 1V 720kB 0C~85C TJ

XC7A12T-1CSG325C Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Surface Mount: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Packaging: Tray
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Pitch: 0.8mm
  • Supply Voltage: 1V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Operating Temperature: 0°C~85°C TJ
  • Voltage - Supply: 0.95V~1.05V
  • Memory Type: DDR3
  • Package / Case: 324-LFBGA, CSPBGA
  • JESD-30 Code: S-PBGA-B325
  • RAM Size: 720kB
  • RoHS Status: ROHS3 Compliant
  • Speed Grade: 1
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Max Junction Temperature (Tj): 125°C
  • Factory Lead Time: 10 Weeks
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • Height: 1.5mm
  • Number of LABs/CLBs: 1000
  • Number of I/O: 150
  • Number of Terminations: 325
  • Series: Artix-7
  • Number of Logic Elements/Cells: 12800
  • Total RAM Bits: 737280
  • Memory Size: 720kB

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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