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  • Manufacturer No:
    XC4008E-3PC84C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC4008E-3PC84C
  • SKU:
    5164599
  • Description:
    Contains Lead CMOS 1999 Non-RoHS Compliant FPGA 0C~85C TJ 1.3kB 2ns 125MHz

XC4008E-3PC84C Details

Contains Lead CMOS 1999 Non-RoHS Compliant FPGA 0C~85C TJ 1.3kB 2ns 125MHz

XC4008E-3PC84C Specification Parameters

  • Mounting Type: Surface Mount
  • Radiation Hardening: No
  • Part Status: Obsolete
  • Operating Supply Voltage: 5V
  • Packaging: Tray
  • Pbfree Code: no
  • JESD-609 Code: e0
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Pitch: 1.27mm
  • Height Seated (Max): 5.08mm
  • Published: 1999
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Peak Reflow Temperature (Cel): 225
  • Number of Terminations: 84
  • Pin Count: 84
  • Number of Outputs: 144
  • Operating Temperature: 0°C~85°C TJ
  • Number of Logic Cells: 324
  • Combinatorial Delay of a CLB-Max: 2 ns
  • Number of Gates: 8000
  • Number of Logic Elements/Cells: 770
  • RAM Size: 1.3kB
  • Base Part Number: XC4008E
  • Mount: Surface Mount
  • RoHS Status: Non-RoHS Compliant
  • Supply Voltage: 5V
  • Power Supplies: 5V
  • Speed Grade: 3
  • Lead Free: Contains Lead
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Position: QUAD
  • Terminal Form: J BEND
  • Number of I/O: 61
  • Subcategory: Field Programmable Gate Arrays
  • Clock Frequency: 125MHz
  • Number of Pins: 84
  • Voltage - Supply: 4.75V~5.25V
  • Terminal Finish: Tin/Lead (Sn85Pb15)
  • Number of CLBs: 324
  • Number of LABs/CLBs: 324
  • Number of Equivalent Gates: 6000
  • Package / Case: 84-LCC (J-Lead)
  • Series: XC4000E/X
  • Total RAM Bits: 10368
  • Number of Registers: 936

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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