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- Manufacturer No：XC3S1600E-4FG484I
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC3S1600E-4FG484I
- SKU：5164730
- Description：Spartan®-3E XC3S1600E 484-BBGA Tin/Lead (Sn63Pb37) field programmable gate array 2.6mm 1.2V 572MHz 0.76ns
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User Guide
XC3S1600E-4FG484I Details
Spartan®-3E XC3S1600E 484-BBGA Tin/Lead (Sn63Pb37) field programmable gate array 2.6mm 1.2V 572MHz 0.76ns
XC3S1600E-4FG484I Specification Parameters
- Part Status: Active
- Mount: Surface Mount
- Speed Grade: 4
- Pbfree Code: no
- Qualification Status: Not Qualified
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1mm
- Terminal Form: BALL
- Operating Supply Voltage: 1.2V
- Subcategory: Field Programmable Gate Arrays
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Width: 23mm
- Operating Temperature: -40°C~100°C TJ
- Number of Pins: 484
- Voltage - Supply: 1.14V~1.26V
- Power Supplies: 1.21.2/3.32.5V
- Number of I/O: 376
- Number of Outputs: 294
- Combinatorial Delay of a CLB-Max: 0.76 ns
- Total RAM Bits: 663552
- Number of Gates: 1600000
- Number of Registers: 29504
- Mounting Type: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Packaging: Tray
- Factory Lead Time: 10 Weeks
- JESD-609 Code: e0
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Published: 2007
- Terminal Position: BOTTOM
- Supply Voltage: 1.2V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Length: 23mm
- Height Seated (Max): 2.6mm
- Number of Terminations: 484
- Pin Count: 484
- ECCN Code: 3A991.D
- Package / Case: 484-BBGA
- Clock Frequency: 572MHz
- Series: Spartan?-3E
- RAM Size: 81kB
- Number of LABs/CLBs: 3688
- Number of Logic Elements/Cells: 33192
- Base Part Number: XC3S1600E
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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