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  • Manufacturer No:
    XCR3256XL-12FTG256C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - CPLDs (Complex Programmable Logic Devices)
  • Datasheet:
    XCR3256XL-12FTG256C
  • SKU:
    5164777
  • Description:
    YES 256-LBGA 1996 CoolRunner XPLA3 complex programmable logic device 88MHz 17mm 10.8ns 3V~3.6V

XCR3256XL-12FTG256C Details

YES 256-LBGA 1996 CoolRunner XPLA3 complex programmable logic device 88MHz 17mm 10.8ns 3V~3.6V

XCR3256XL-12FTG256C Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • JTAG BST: YES
  • Supply Voltage: 3.3V
  • Packaging: Tray
  • Qualification Status: Not Qualified
  • Technology: CMOS
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Speed Grade: 12
  • HTS Code: 8542.39.00.01
  • Terminal Position: BOTTOM
  • JESD-609 Code: e1
  • Voltage Supply - Internal: 3V~3.6V
  • Pin Count: 256
  • Memory Type: EEPROM
  • Width: 17mm
  • Published: 1996
  • Propagation Delay: 12 ns
  • Package / Case: 256-LBGA
  • Number of I/O: 164
  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Series: CoolRunner XPLA3
  • RoHS Status: ROHS3 Compliant
  • Mount: Surface Mount
  • Pbfree Code: yes
  • Additional Feature: YES
  • Operating Supply Voltage: 3.3V
  • Factory Lead Time: 10 Weeks
  • Number of Logic Elements/Cells: 16
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1mm
  • Supply Voltage-Max (Vsup): 3.6V
  • Terminal Form: BALL
  • Operating Temperature: 0°C~70°C TA
  • Number of Terminations: 256
  • Number of Macro Cells: 256
  • Length: 17mm
  • Output Function: MACROCELL
  • Height Seated (Max): 1.55mm
  • Subcategory: Programmable Logic Devices
  • Number of Gates: 6000
  • Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Max Frequency: 88MHz
  • Delay Time tpd(1) Max: 10.8ns

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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