XC6SLX75T-3FGG676IXilinx
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    • Manufacturer No：
      XC6SLX75T-3FGG676I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - FPGAs (Field Programmable Gate Array)
    • Datasheet：
      XC6SLX75T-3FGG676I
    • SKU：
      5164936
    • Description：
      CMOS 2008 ROHS3Compliant BALL FPGA -40C~100C TJ 387kB 0.21ns 862MHz

    User Guide

    User Guide

    XC6SLX75T-3FGG676I Details

    CMOS 2008 ROHS3Compliant BALL FPGA -40C~100C TJ 387kB 0.21ns 862MHz

    XC6SLX75T-3FGG676I Specification Parameters

    • Part Status: Active
    • Mounting Type: Surface Mount
    • Pbfree Code: yes
    • Speed Grade: 3
    • Qualification Status: Not Qualified
    • Moisture Sensitivity Level (MSL): 3 (168 Hours)
    • Published: 2008
    • Terminal Position: BOTTOM
    • JESD-609 Code: e1
    • Operating Supply Voltage: 1.2V
    • Subcategory: Field Programmable Gate Arrays
    • Length: 27mm
    • Peak Reflow Temperature (Cel): 250
    • Height Seated (Max): 2.44mm
    • Number of Pins: 676
    • Package / Case: 676-BGA
    • Number of I/O: 348
    • Combinatorial Delay of a CLB-Max: 0.21 ns
    • Number of LABs/CLBs: 5831
    • Number of Registers: 93296
    • Base Part Number: XC6SLX75
    • RoHS Status: ROHS3 Compliant
    • Mount: Surface Mount
    • Packaging: Tray
    • Factory Lead Time: 10 Weeks
    • Technology: CMOS
    • Time@Peak Reflow Temperature-Max (s): 30
    • Terminal Pitch: 1mm
    • Terminal Form: BALL
    • Supply Voltage: 1.2V
    • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
    • Operating Temperature: -40°C~100°C TJ
    • Width: 27mm
    • Voltage - Supply: 1.14V~1.26V
    • Number of Terminations: 676
    • Pin Count: 676
    • Clock Frequency: 862MHz
    • Number of Outputs: 348
    • Number of Logic Elements/Cells: 74637
    • RAM Size: 387kB
    • Total RAM Bits: 3170304
    • Series: Spartan? 6 LXT
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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