XC5VLX30T-2FFG323IXilinx
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    • Manufacturer No：
      XC5VLX30T-2FFG323I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - FPGAs (Field Programmable Gate Array)
    • Datasheet：
      XC5VLX30T-2FFG323I
    • SKU：
      5165161
    • Description：
      CMOS 1999 ROHS3Compliant BALL FPGA -40C~100C TJ 162kB 1V 19mm

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    User Guide

    XC5VLX30T-2FFG323I Details

    CMOS 1999 ROHS3Compliant BALL FPGA -40C~100C TJ 162kB 1V 19mm

    XC5VLX30T-2FFG323I Specification Parameters

    • Part Status: Active
    • Speed Grade: 2
    • Mount: Surface Mount
    • Packaging: Tray
    • Qualification Status: Not Qualified
    • Time@Peak Reflow Temperature-Max (s): 30
    • Terminal Pitch: 1mm
    • Terminal Form: BALL
    • Operating Supply Voltage: 1V
    • Published: 1999
    • Subcategory: Field Programmable Gate Arrays
    • Length: 19mm
    • Operating Temperature: -40°C~100°C TJ
    • Number of I/O: 172
    • Voltage - Supply: 0.95V~1.05V
    • Number of Terminations: 323
    • Number of Pins: 323
    • Series: Virtex?-5 LXT
    • Number of Logic Elements/Cells: 30720
    • Base Part Number: XC5VLX30
    • RoHS Status: ROHS3 Compliant
    • Mounting Type: Surface Mount
    • ECCN Code: EAR99
    • Factory Lead Time: 10 Weeks
    • Technology: CMOS
    • Reach Compliance Code: not_compliant
    • Terminal Position: BOTTOM
    • Supply Voltage: 1V
    • JESD-609 Code: e1
    • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • Width: 19mm
    • Peak Reflow Temperature (Cel): 250
    • Number of Outputs: 172
    • Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
    • Pin Count: 323
    • Number of LABs/CLBs: 2400
    • RAM Size: 162kB
    • Total RAM Bits: 1327104
    • Package / Case: 323-BBGA, FCBGA
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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