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- Manufacturer No：XC7A200T-L2FBG676E
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC7A200T-L2FBG676E
- SKU：5165190
- Description：Artix-7 XC7A200T 676-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 2.54mm 1V 1286MHz 110ps
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User Guide
XC7A200T-L2FBG676E Details
Artix-7 XC7A200T 676-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 2.54mm 1V 1286MHz 110ps
XC7A200T-L2FBG676E Specification Parameters
- Part Status: Active
- Mount: Surface Mount
- Radiation Hardening: No
- Packaging: Tray
- Height Seated (Max): 2.54mm
- Published: 2009
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- JESD-609 Code: e1
- Subcategory: Field Programmable Gate Arrays
- Supply Voltage: 0.9V
- Length: 27mm
- Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of Outputs: 400
- ECCN Code: 3A991.D
- Number of Terminations: 676
- Voltage - Supply: 0.95V~1.05V
- JESD-30 Code: S-PBGA-B676
- RAM Size: 1.6MB
- Clock Frequency: 1286MHz
- Number of Logic Elements/Cells: 215360
- Number of Registers: 269200
- Combinatorial Delay of a CLB-Max: 1.51 ns
- Mounting Type: Surface Mount
- Pbfree Code: yes
- RoHS Status: Non-RoHS Compliant
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Operating Supply Voltage: 1V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Power Supplies: 0.9V
- Width: 27mm
- Number of I/O: 400
- Number of Inputs: 400
- Operating Temperature: 0°C~100°C TJ
- Pin Count: 676
- Package / Case: 676-BBGA, FCBGA
- Series: Artix-7
- Propagation Delay: 110 ps
- Number of LABs/CLBs: 16825
- Total RAM Bits: 13455360
- Base Part Number: XC7A200T
- Additional Feature: ALSO OPERATES AT 1V SUPPLY
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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