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- Manufacturer No：XC2VP7-6FFG672C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC2VP7-6FFG672C
- SKU：5165304
- Description：Virtex®-II Pro XC2VP7 672-BBGA FCBGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 27mm 1.5V 1200MHz 0.32ns
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User Guide
XC2VP7-6FFG672C Details
Virtex®-II Pro XC2VP7 672-BBGA FCBGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 27mm 1.5V 1200MHz 0.32ns
XC2VP7-6FFG672C Specification Parameters
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Lead Free: Lead Free
- Factory Lead Time: 6 Weeks
- Qualification Status: Not Qualified
- Technology: CMOS
- Reach Compliance Code: not_compliant
- HTS Code: 8542.39.00.01
- Published: 2004
- JESD-609 Code: e1
- Operating Supply Voltage: 1.5V
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Length: 27mm
- Voltage - Supply: 1.425V~1.575V
- Pin Count: 672
- ECCN Code: 3A991.D
- Number of Outputs: 396
- Package / Case: 672-BBGA, FCBGA
- Series: Virtex?-II Pro
- Power Supplies: 1.51.5/3.32/2.52.5V
- Number of Logic Elements/Cells: 11088
- Number of Registers: 9856
- Base Part Number: XC2VP7
- Mounting Type: Surface Mount
- Pbfree Code: yes
- Part Status: Obsolete
- Packaging: Tray
- Speed Grade: 6
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Terminal Form: BALL
- Supply Voltage: 1.5V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 245
- Operating Temperature: 0°C~85°C TJ
- Width: 27mm
- Number of Terminations: 672
- Number of Pins: 672
- Number of I/O: 396
- Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Clock Frequency: 1200MHz
- Combinatorial Delay of a CLB-Max: 0.32 ns
- Number of LABs/CLBs: 1232
- Total RAM Bits: 811008
- RAM Size: 99kB
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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