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- Manufacturer No：XC2C256-7CPG132C
- Manufacturer：Xilinx
- Category：Embedded - CPLDs (Complex Programmable Logic Devices)
- Datasheet：XC2C256-7CPG132C
- SKU：5165770
- Description：REAL DIGITAL DESIGN TECHNOLOGY 132-TFBGA CSPBGA 2001 XC2C256 complex programmable logic device 152MHz 8mm 7.5ns 1.7V~1.9V
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User Guide
XC2C256-7CPG132C Details
REAL DIGITAL DESIGN TECHNOLOGY 132-TFBGA CSPBGA 2001 XC2C256 complex programmable logic device 152MHz 8mm 7.5ns 1.7V~1.9V
XC2C256-7CPG132C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- JTAG BST: YES
- Packaging: Tray
- Qualification Status: Not Qualified
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 1.8V
- Terminal Pitch: 0.5mm
- HTS Code: 8542.39.00.01
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Length: 8mm
- Height Seated (Max): 1.1mm
- Min Supply Voltage: 1.7V
- Max Supply Voltage: 1.9V
- Output Function: MACROCELL
- Number of Terminations: 132
- Pin Count: 132
- Turn On Delay Time: 7.5 ns
- Number of I/O: 106
- Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Max Frequency: 152MHz
- Delay Time tpd(1) Max: 6.7ns
- Base Part Number: XC2C256
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Pbfree Code: yes
- Lead Free: Lead Free
- Factory Lead Time: 10 Weeks
- Number of Logic Elements/Cells: 16
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Operating Supply Voltage: 1.8V
- Speed Grade: 7
- Published: 2001
- Terminal Form: BALL
- Operating Temperature: 0°C~70°C TA
- Width: 8mm
- Number of Macro Cells: 256
- Contact Plating: Copper, Silver, Tin
- Voltage Supply - Internal: 1.7V~1.9V
- Subcategory: Programmable Logic Devices
- Number of Pins: 132
- Propagation Delay: 7.5 ns
- Programmable Type: In System Programmable
- Number of Gates: 6000
- Series: CoolRunner II
- Additional Feature: REAL DIGITAL DESIGN TECHNOLOGY
- Package / Case: 132-TFBGA, CSPBGA
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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