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- Manufacturer No：XC7A200T-2FFG1156C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC7A200T-2FFG1156C
- SKU：5166271
- Description：Artix-7 XC7A200T 1156-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.1mm 1V 1286MHz 1.05ns
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User Guide
XC7A200T-2FFG1156C Details
Artix-7 XC7A200T 1156-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.1mm 1V 1286MHz 1.05ns
XC7A200T-2FFG1156C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Surface Mount: YES
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Supply Voltage: 1V
- JESD-609 Code: e1
- Number of I/O: 500
- Length: 35mm
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Operating Temperature: 0°C~85°C TJ
- ECCN Code: 3A991.D
- Voltage - Supply: 0.95V~1.05V
- Package / Case: 1156-BBGA, FCBGA
- Combinatorial Delay of a CLB-Max: 1.05 ns
- JESD-30 Code: S-PBGA-B1156
- Clock Frequency: 1286MHz
- Number of Logic Elements/Cells: 215360
- Number of Registers: 269200
- RoHS Status: ROHS3 Compliant
- Pbfree Code: yes
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Packaging: Tray
- Qualification Status: Not Qualified
- Published: 2009
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Power Supplies: 1V
- Number of Outputs: 500
- Number of Inputs: 500
- Width: 35mm
- Subcategory: Field Programmable Gate Arrays
- Height Seated (Max): 3.1mm
- Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Memory Size: 1GB
- Memory Type: DDR3
- Series: Artix-7
- RAM Size: 1.6MB
- Speed Grade: -2
- Number of LABs/CLBs: 16825
- Total RAM Bits: 13455360
- Base Part Number: XC7A200T
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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