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- Manufacturer No：XC3S400A-4FGG320C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC3S400A-4FGG320C
- SKU：5166339
- Description：Spartan®-3A XC3S400A 320-BGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 2mm 1.22.5/3.3V 667MHz 0.71ns
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User Guide
XC3S400A-4FGG320C Details
Spartan®-3A XC3S400A 320-BGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 2mm 1.22.5/3.3V 667MHz 0.71ns
XC3S400A-4FGG320C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Surface Mount: YES
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Height Seated (Max): 2mm
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Supply Voltage: 1.2V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Operating Temperature: 0°C~85°C TJ
- Width: 19mm
- Number of Outputs: 192
- Number of Terminations: 320
- Clock Frequency: 667MHz
- Number of LABs/CLBs: 896
- Number of Gates: 400000
- Number of Logic Elements/Cells: 8064
- Combinatorial Delay of a CLB-Max: 0.71 ns
- Number of I/O: 251
- Package / Case: 320-BGA
- Base Part Number: XC3S400A
- RoHS Status: ROHS3 Compliant
- Pbfree Code: yes
- Packaging: Tray
- Qualification Status: Not Qualified
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Published: 1999
- Subcategory: Field Programmable Gate Arrays
- Length: 19mm
- Voltage - Supply: 1.14V~1.26V
- ECCN Code: 3A991.D
- Pin Count: 320
- Number of CLBs: 896
- Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Power Supplies: 1.22.5/3.3V
- Total RAM Bits: 368640
- Series: Spartan?-3A
- Number of Inputs: 251
- JESD-30 Code: S-PBGA-B320
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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