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  • Manufacturer No:
    XC7Z035-1FBG676C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - System On Chip (SoC)
  • Datasheet:
    XC7Z035-1FBG676C
  • SKU:
    5166996
  • Description:
    IC SOC CORTEX-A9 667MHZ 676FCBGA

XC7Z035-1FBG676C Details

IC SOC CORTEX-A9 667MHZ 676FCBGA

XC7Z035-1FBG676C Specification Parameters

  • Part Status: Active
  • Mount: Surface Mount
  • Boundary Scan: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Factory Lead Time: 10 Weeks
  • Technology: CMOS
  • Published: 2010
  • Terminal Form: BALL
  • JESD-609 Code: e1
  • Core Architecture: ARM
  • Length: 27mm
  • Number of I/O: 130
  • RAM Size: 256kB
  • Max Supply Voltage: 1.05V
  • Frequency: 667MHz
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Package / Case: 676-BBGA, FCBGA
  • Peripherals: DMA
  • Interface: CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • RAM (words): 256000
  • Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
  • RoHS Status: ROHS3 Compliant
  • Speed Grade: 1
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Packaging: Tray
  • Height Seated (Max): 2.54mm
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • Contact Plating: Copper, Silver, Tin
  • Operating Temperature: 0°C~85°C TJ
  • Width: 27mm
  • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Architecture: MCU, FPGA
  • Number of Terminations: 676
  • Min Supply Voltage: 950mV
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • JESD-30 Code: S-PBGA-B676
  • Series: Zynq?-7000
  • Propagation Delay: 120 ps
  • Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB
  • Number of Registers: 343800

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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