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Inventory:38
  • Qty Unit Price price
  • 1 $202.878 $202.878
  • 10 $200.869 $2008.69
  • 100 $198.88 $19888
  • 1000 $196.91 $196910
  • 10000 $194.96 $1949600

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  • Manufacturer No:
    XC6SLX100-3FGG484C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC6SLX100-3FGG484C
  • SKU:
    5167011
  • Description:
    CMOS 2008 ROHS3Compliant BALL FPGA 0C~85C TJ 603kB 0.21ns 862MHz

XC6SLX100-3FGG484C Details

CMOS 2008 ROHS3Compliant BALL FPGA 0C~85C TJ 603kB 0.21ns 862MHz

XC6SLX100-3FGG484C Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Pbfree Code: yes
  • Speed Grade: 3
  • Qualification Status: Not Qualified
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Published: 2008
  • Terminal Position: BOTTOM
  • JESD-609 Code: e1
  • Operating Supply Voltage: 1.2V
  • Subcategory: Field Programmable Gate Arrays
  • Height Seated (Max): 2.6mm
  • Number of Pins: 484
  • Peak Reflow Temperature (Cel): 250
  • Number of Outputs: 326
  • Package / Case: 484-BBGA
  • RAM Size: 603kB
  • Clock Frequency: 862MHz
  • Number of LABs/CLBs: 7911
  • Number of Registers: 126576
  • RoHS Status: ROHS3 Compliant
  • Mount: Surface Mount
  • Packaging: Tray
  • Factory Lead Time: 10 Weeks
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1mm
  • Terminal Form: BALL
  • Supply Voltage: 1.2V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Operating Temperature: 0°C~85°C TJ
  • Number of Terminations: 484
  • Pin Count: 484
  • Voltage - Supply: 1.14V~1.26V
  • Number of I/O: 326
  • Series: Spartan?-6 LX
  • Total RAM Bits: 4939776
  • Combinatorial Delay of a CLB-Max: 0.21 ns
  • Number of Logic Elements/Cells: 101261
  • Base Part Number: XC6SLX100

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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