XC7Z007S-1CLG225CXilinx
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    • Manufacturer No：
      XC7Z007S-1CLG225C
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
      XC7Z007S-1CLG225C
    • SKU：
      5167333
    • Description：
      IC SOC CORTEX-A9 667MHZ 225BGA

    User Guide

    User Guide

    XC7Z007S-1CLG225C Details

    IC SOC CORTEX-A9 667MHZ 225BGA

    XC7Z007S-1CLG225C Specification Parameters

    • Part Status: Active
    • Pbfree Code: yes
    • Boundary Scan: YES
    • Published: 2016
    • Technology: CMOS
    • Moisture Sensitivity Level (MSL): 3 (168 Hours)
    • Terminal Position: BOTTOM
    • Terminal Form: BALL
    • JESD-609 Code: e1
    • Height Seated (Max): 1.5mm
    • Number of Terminations: 225
    • Width: 13mm
    • Operating Temperature: 0°C~85°C TJ
    • Supply Voltage-Min (Vsup): 0.95V
    • Supply Voltage-Max (Vsup): 1.05V
    • Speed: 667MHz
    • Peripherals: DMA
    • RAM (words): 256000
    • JESD-30 Code: S-PBGA-B225
    • Primary Attributes: Artix?-7 FPGA, 23K Logic Cells
    • RoHS Status: ROHS3 Compliant
    • Surface Mount: YES
    • Packaging: Tray
    • Factory Lead Time: 10 Weeks
    • Peak Reflow Temperature (Cel): 260
    • Time@Peak Reflow Temperature-Max (s): 30
    • Terminal Pitch: 0.8mm
    • Supply Voltage: 1V
    • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
    • Number of I/O: 54
    • Length: 13mm
    • Core Architecture: ARM
    • RAM Size: 256kB
    • Architecture: MCU, FPGA
    • Clock Frequency: 667MHz
    • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    • Series: Zynq?-7000
    • Package / Case: 225-LFBGA, CSPBGA
    • Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
    • Bus Compatibility: CAN; ETHERNET; I2C; PCI; SPI; UART; USB
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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