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- Manufacturer No：XCS30-3TQ144C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XCS30-3TQ144C
- SKU：5168810
- Description：Spartan® XCS30 144-LQFP Tin/Lead (Sn85Pb15) field programmable gate array 1.6mm 5V 125MHz 1.6ns
User Guide
User Guide
XCS30-3TQ144C Details
Spartan® XCS30 144-LQFP Tin/Lead (Sn85Pb15) field programmable gate array 1.6mm 5V 125MHz 1.6ns
XCS30-3TQ144C Specification Parameters
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Part Status: Obsolete
- Operating Supply Voltage: 5V
- Packaging: Tray
- Lead Free: Contains Lead
- JESD-609 Code: e0
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Height Seated (Max): 1.6mm
- Terminal Position: QUAD
- Width: 20mm
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Voltage - Supply: 4.75V~5.25V
- Number of Pins: 144
- Terminal Finish: Tin/Lead (Sn85Pb15)
- Package / Case: 144-LQFP
- Number of Outputs: 196
- Number of Logic Cells: 576
- Number of LABs/CLBs: 576
- Combinatorial Delay of a CLB-Max: 1.6 ns
- Number of Registers: 1536
- Number of Logic Elements/Cells: 1368
- Base Part Number: XCS30
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Supply Voltage: 5V
- Power Supplies: 5V
- Speed Grade: 3
- Qualification Status: Not Qualified
- Terminal Form: GULL WING
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Reach Compliance Code: not_compliant
- Terminal Pitch: 0.5mm
- Length: 20mm
- Published: 1999
- Subcategory: Field Programmable Gate Arrays
- Clock Frequency: 125MHz
- Number of Terminations: 144
- Pin Count: 144
- Operating Temperature: 0°C~85°C TJ
- Number of Equivalent Gates: 10000
- Number of I/O: 113
- Number of CLBs: 576
- Total RAM Bits: 18432
- RAM Size: 2.3kB
- Number of Gates: 30000
- Series: Spartan?
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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