XC6VLX550T-1FFG1759IXilinx
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    • Manufacturer No：
      XC6VLX550T-1FFG1759I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - FPGAs (Field Programmable Gate Array)
    • Datasheet：
      XC6VLX550T-1FFG1759I
    • SKU：
      5169093
    • Description：
      Copper Silver Tin CMOS 2008 ROHS3Compliant FPGA -40C~100C TJ 2.8MB 5.08ns 1V

    User Guide

    User Guide

    XC6VLX550T-1FFG1759I Details

    Copper Silver Tin CMOS 2008 ROHS3Compliant FPGA -40C~100C TJ 2.8MB 5.08ns 1V

    XC6VLX550T-1FFG1759I Specification Parameters

    • Part Status: Active
    • Mounting Type: Surface Mount
    • Speed Grade: 1
    • Packaging: Tray
    • Qualification Status: Not Qualified
    • Time@Peak Reflow Temperature-Max (s): 30
    • Published: 2008
    • Terminal Form: BALL
    • JESD-609 Code: e1
    • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
    • Peak Reflow Temperature (Cel): 245
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    • Width: 42.5mm
    • Number of Outputs: 840
    • Voltage - Supply: 0.95V~1.05V
    • Series: Virtex?-6 LXT
    • Number of Pins: 1759
    • Number of Logic Elements/Cells: 549888
    • Base Part Number: XC6VLX550T
    • RoHS Status: ROHS3 Compliant
    • Mount: Surface Mount
    • Pbfree Code: yes
    • Factory Lead Time: 10 Weeks
    • Technology: CMOS
    • Reach Compliance Code: not_compliant
    • Terminal Position: BOTTOM
    • Supply Voltage: 1V
    • Height Seated (Max): 3.5mm
    • Subcategory: Field Programmable Gate Arrays
    • Contact Plating: Copper, Silver, Tin
    • Operating Temperature: -40°C~100°C TJ
    • Length: 42.5mm
    • Number of I/O: 840
    • Package / Case: 1760-BBGA, FCBGA
    • RAM Size: 2.8MB
    • Combinatorial Delay of a CLB-Max: 5.08 ns
    • Number of LABs/CLBs: 42960
    • Total RAM Bits: 23298048
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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