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- Manufacturer No：XC2C32A-4QFG32C
- Manufacturer：Xilinx
- Category：Embedded - CPLDs (Complex Programmable Logic Devices)
- Datasheet：XC2C32A-4QFG32C
- SKU：5169284
- Description：REAL DIGITAL DESIGN TECHNOLOGY 32-VFQFN Exposed Pad 2001 XC2C32A complex programmable logic device 323MHz 5mm 4ns 1.7V~1.9V
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User Guide
XC2C32A-4QFG32C Details
REAL DIGITAL DESIGN TECHNOLOGY 32-VFQFN Exposed Pad 2001 XC2C32A complex programmable logic device 323MHz 5mm 4ns 1.7V~1.9V
XC2C32A-4QFG32C Specification Parameters
- Part Status: Active
- Number of Logic Elements/Cells: 2
- Mount: Surface Mount
- Pbfree Code: yes
- JESD-609 Code: e3
- Terminal Position: DUAL
- Packaging: Tray
- Qualification Status: Not Qualified
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Operating Supply Voltage: 1.8V
- Pin Count: 32
- Length: 5mm
- Terminal Pitch: 0.5mm
- Published: 2001
- Number of I/O: 21
- Min Supply Voltage: 1.7V
- Voltage Supply - Internal: 1.7V~1.9V
- Subcategory: Programmable Logic Devices
- Propagation Delay: 4 ns
- Programmable Type: In System Programmable
- Number of Gates: 750
- Series: CoolRunner II
- Additional Feature: REAL DIGITAL DESIGN TECHNOLOGY
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- JTAG BST: YES
- Contact Plating: Tin
- Speed Grade: 4
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 1.8V
- Number of Terminations: 32
- Number of Macro Cells: 32
- Width: 5mm
- Height Seated (Max): 1mm
- Terminal Form: NO LEAD
- Operating Temperature: 0°C~70°C TA
- Max Supply Voltage: 1.9V
- Output Function: MACROCELL
- Package / Case: 32-VFQFN Exposed Pad
- Turn On Delay Time: 4 ns
- Memory Type: ROMless
- Delay Time tpd(1) Max: 3.8ns
- Max Frequency: 323MHz
- Base Part Number: XC2C32A
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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