XC7Z030-3FFG676EXilinx
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    • Manufacturer No：
      XC7Z030-3FFG676E
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
      Get the PDF file
    • SKU：
      5169317
    • Description：
      MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 676-Pin FCBGA
    • Quantity：
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    Inventory:4
    • Qty Unit Price price
    • 1 $940952.65 $940952.65
    • 10 $931636.287 $9316362.87
    • 100 $922412.165 $92241216.5
    • 1000 $913279.371 $913279371
    • 10000 $904237 $9042370000

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    • Manufacturer No：
      XC7Z030-3FFG676E
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
      XC7Z030-3FFG676E
    • SKU：
      5169317
    • Description：
      MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 676-Pin FCBGA

    User Guide

    User Guide

    XC7Z030-3FFG676E Details

    MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 676-Pin FCBGA

    XC7Z030-3FFG676E Specification Parameters

    • Part Status: Active
    • Radiation Hardening: No
    • Boundary Scan: YES
    • Factory Lead Time: 10 Weeks
    • Time@Peak Reflow Temperature-Max (s): 30
    • Terminal Pitch: 1mm
    • Terminal Position: BOTTOM
    • Supply Voltage: 1V
    • JESD-609 Code: e1
    • Peak Reflow Temperature (Cel): 245
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • Core Architecture: ARM
    • Number of I/O: 130
    • Frequency: 1GHz
    • Supply Voltage-Max (Vsup): 1.05V
    • Operating Temperature: 0°C~100°C TJ
    • Number of Pins: 676
    • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    • Peripherals: DMA
    • Interface: CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    • Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB
    • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
    • Base Part Number: XC7Z030
    • RoHS Status: ROHS3 Compliant
    • Surface Mount: YES
    • Packaging: Tray
    • Technology: CMOS
    • Published: 2009
    • HTS Code: 8542.39.00.01
    • Terminal Form: BALL
    • Operating Supply Voltage: 1V
    • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
    • Contact Plating: Copper, Silver, Tin
    • Data Bus Width: 32b
    • Length: 27mm
    • RAM Size: 256kB
    • Architecture: MCU, FPGA
    • ECCN Code: 3A991.D
    • Number of Terminations: 676
    • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    • Package / Case: 676-BBGA, FCBGA
    • Series: Zynq?-7000
    • RAM (words): 256000
    • Speed Grade: -3
    • Height Seated (Max): 3.24mm
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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