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- Manufacturer No：XC6VSX315T-L1FFG1156I
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC6VSX315T-L1FFG1156I
- SKU：5170519
- Description：Virtex®-6SXT XC6VSX315T 1156-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.5mm 900mV 1098MHz 5.87ns
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User Guide
XC6VSX315T-L1FFG1156I Details
Virtex®-6SXT XC6VSX315T 1156-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.5mm 900mV 1098MHz 5.87ns
XC6VSX315T-L1FFG1156I Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Pbfree Code: yes
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Reach Compliance Code: not_compliant
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Length: 35mm
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 245
- Supply Voltage: 0.9V
- Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of Outputs: 600
- ECCN Code: 3A991.D
- Package / Case: 1156-BBGA, FCBGA
- Power Supplies: 11.2/2.5V
- Combinatorial Delay of a CLB-Max: 5.87 ns
- Series: Virtex?-6 SXT
- Total RAM Bits: 25952256
- Voltage - Supply: 0.91V~0.97V
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Packaging: Tray
- Qualification Status: Not Qualified
- Time@Peak Reflow Temperature-Max (s): 30
- Published: 2008
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Height Seated (Max): 3.5mm
- Width: 35mm
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Operating Temperature: -40°C~100°C TJ
- Number of I/O: 600
- Operating Supply Voltage: 900mV
- Number of Pins: 1156
- Clock Frequency: 1098MHz
- RAM Size: 3.1MB
- Number of LABs/CLBs: 24600
- Number of Logic Elements/Cells: 314880
- Base Part Number: XC6VSX315T
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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