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  • Manufacturer No:
    XC7S50-2CSGA324C
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    Get the PDF file
  • SKU:
    5170650
  • Description:
    Spartan®-7 324-LFBGA CSPBGA Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 1V 1.05ns 337.5kB 0C~85C TJ
  • Quantity:
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Inventory:438
  • Qty Unit Price price
  • 1 $78.817 $78.817
  • 10 $78.036 $780.36
  • 100 $77.263 $7726.3
  • 1000 $76.498 $76498
  • 10000 $75.74 $757400

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  • Manufacturer No:
    XC7S50-2CSGA324C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC7S50-2CSGA324C
  • SKU:
    5170650
  • Description:
    Spartan®-7 324-LFBGA CSPBGA Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 1V 1.05ns 337.5kB 0C~85C TJ

XC7S50-2CSGA324C Details

Spartan®-7 324-LFBGA CSPBGA Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 1V 1.05ns 337.5kB 0C~85C TJ

XC7S50-2CSGA324C Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Packaging: Tray
  • Published: 2012
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Number of Terminations: 324
  • Voltage - Supply: 0.95V~1.05V
  • JESD-30 Code: S-PBGA-B324
  • Series: Spartan?-7
  • Number of Logic Elements/Cells: 52160
  • RAM Size: 337.5kB
  • RoHS Status: ROHS3 Compliant
  • Surface Mount: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Factory Lead Time: 10 Weeks
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • Operating Temperature: 0°C~85°C TJ
  • Number of I/O: 210
  • Package / Case: 324-LFBGA, CSPBGA
  • Combinatorial Delay of a CLB-Max: 1.05 ns
  • Number of LABs/CLBs: 4075
  • Total RAM Bits: 2764800

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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