XC7Z035-1FFG676CXilinx
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    • Manufacturer No：
      XC7Z035-1FFG676C
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
      XC7Z035-1FFG676C
    • SKU：
      5170742
    • Description：
      IC SOC CORTEX-A9 667MHZ 676FCBGA

    User Guide

    User Guide

    XC7Z035-1FFG676C Details

    IC SOC CORTEX-A9 667MHZ 676FCBGA

    XC7Z035-1FFG676C Specification Parameters

    • Part Status: Active
    • Surface Mount: YES
    • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
    • Packaging: Tray
    • Technology: CMOS
    • Terminal Pitch: 1mm
    • Terminal Position: BOTTOM
    • Supply Voltage: 1V
    • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
    • Core Architecture: ARM
    • Length: 27mm
    • Number of I/O: 130
    • Supply Voltage-Min (Vsup): 0.95V
    • Supply Voltage-Max (Vsup): 1.05V
    • Number of Terminations: 676
    • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    • Package / Case: 676-BBGA, FCBGA
    • Peripherals: DMA
    • Interface: CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    • Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB
    • Additional Feature: PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    • RoHS Status: ROHS3 Compliant
    • Boundary Scan: YES
    • Peak Reflow Temperature (Cel): NOT SPECIFIED
    • Factory Lead Time: 10 Weeks
    • Published: 2010
    • HTS Code: 8542.39.00.01
    • Terminal Form: BALL
    • JESD-609 Code: e1
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • Operating Temperature: 0°C~85°C TJ
    • Width: 27mm
    • RAM Size: 256kB
    • Architecture: MCU, FPGA
    • ECCN Code: 3A991.D
    • Frequency: 667MHz
    • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    • JESD-30 Code: S-PBGA-B676
    • Series: Zynq?-7000
    • RAM (words): 256000
    • Height Seated (Max): 3.37mm
    • Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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