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- Manufacturer No：XC2VP70-6FF1704C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC2VP70-6FF1704C
- SKU：5170747
- Description：Virtex®-II Pro 1704-BBGA FCBGA Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 3.45mm 1.5V 1200MHz 0.32ns
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User Guide
XC2VP70-6FF1704C Details
Virtex®-II Pro 1704-BBGA FCBGA Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 3.45mm 1.5V 1200MHz 0.32ns
XC2VP70-6FF1704C Specification Parameters
- Packaging: Bulk
- RoHS Status: Non-RoHS Compliant
- Part Status: Obsolete
- Pbfree Code: no
- Speed Grade: 6
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Supply Voltage: 1.5V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Operating Temperature: 0°C~85°C TJ
- Voltage - Supply: 1.425V~1.575V
- Width: 42.5mm
- Clock Frequency: 1200MHz
- Combinatorial Delay of a CLB-Max: 0.32 ns
- Package / Case: 1704-BBGA, FCBGA
- Number of Outputs: 996
- Number of LABs/CLBs: 8272
- Number of Registers: 66176
- Total RAM Bits: 6045696
- Mounting Type: Surface Mount
- Surface Mount: YES
- Factory Lead Time: 6 Weeks
- Qualification Status: Not Qualified
- JESD-609 Code: e0
- Published: 2011
- Reach Compliance Code: not_compliant
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Operating Supply Voltage: 1.5V
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- ECCN Code: 3A001.A.7.A
- Length: 42.5mm
- Height Seated (Max): 3.45mm
- Series: Virtex?-II Pro
- Power Supplies: 1.51.5/3.32/2.52.5V
- Number of I/O: 996
- Number of Inputs: 996
- Number of Logic Elements/Cells: 74448
- RAM Size: 738kB
- JESD-30 Code: S-PBGA-B1704
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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