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  • Manufacturer No:
    XC7K325T-2FFG676I
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC7K325T-2FFG676I
  • SKU:
    5170763
  • Description:
    CMOS 2009 DDR3 ROHS3Compliant FPGA -40C~100C TJ 1GB 0.61ns 1818MHz

XC7K325T-2FFG676I Details

CMOS 2009 DDR3 ROHS3Compliant FPGA -40C~100C TJ 1GB 0.61ns 1818MHz

XC7K325T-2FFG676I Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Surface Mount: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Qualification Status: Not Qualified
  • Reach Compliance Code: not_compliant
  • Factory Lead Time: 11 Weeks
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • JESD-609 Code: e1
  • Subcategory: Field Programmable Gate Arrays
  • Operating Temperature: -40°C~100°C TJ
  • Width: 27mm
  • Number of I/O: 400
  • Number of Inputs: 400
  • Number of Terminations: 676
  • Memory Size: 1GB
  • Voltage - Supply: 0.97V~1.03V
  • Memory Type: DDR3
  • Combinatorial Delay of a CLB-Max: 0.61 ns
  • Series: Kintex?-7
  • Speed Grade: -2
  • Number of LABs/CLBs: 25475
  • Total RAM Bits: 16404480
  • Base Part Number: XC7K325T
  • RoHS Status: ROHS3 Compliant
  • Pbfree Code: yes
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Packaging: Tray
  • Technology: CMOS
  • Published: 2009
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Moisture Sensitivity Level (MSL): 4 (72 Hours)
  • Length: 27mm
  • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Number of Outputs: 400
  • ECCN Code: 3A991.D
  • Pin Count: 676
  • RAM Size: 2MB
  • Package / Case: 676-BBGA, FCBGA
  • JESD-30 Code: S-PBGA-B676
  • Clock Frequency: 1818MHz
  • Power Supplies: 11.83.3V
  • Height Seated (Max): 3.37mm
  • Number of Logic Elements/Cells: 326080
  • Number of Registers: 407600

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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