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- Manufacturer No：XCR3384XL-10FTG256I
- Manufacturer：Xilinx
- Category：Embedded - CPLDs (Complex Programmable Logic Devices)
- Datasheet：XCR3384XL-10FTG256I
- SKU：5171815
- Description：YES 256-LBGA 1996 CoolRunner XPLA3 complex programmable logic device 102MHz 17mm 9ns 2.7V~3.6V
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XCR3384XL-10FTG256I Details
YES 256-LBGA 1996 CoolRunner XPLA3 complex programmable logic device 102MHz 17mm 9ns 2.7V~3.6V
XCR3384XL-10FTG256I Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Pbfree Code: yes
- Additional Feature: YES
- Operating Supply Voltage: 3.3V
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Speed Grade: 10
- Time@Peak Reflow Temperature-Max (s): 30
- Operating Temperature: -40°C~85°C TA
- HTS Code: 8542.39.00.01
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Number of Pins: 256
- Voltage Supply - Internal: 2.7V~3.6V
- Length: 17mm
- Propagation Delay: 10 ns
- Published: 1996
- Subcategory: Programmable Logic Devices
- ECCN Code: 3A991.D
- Number of I/O: 212
- Delay Time tpd(1) Max: 9ns
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Max Frequency: 102MHz
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- JTAG BST: YES
- Supply Voltage: 3.3V
- Packaging: Tray
- Qualification Status: Not Qualified
- Peak Reflow Temperature (Cel): 260
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Number of Logic Elements/Cells: 24
- Terminal Pitch: 1mm
- Supply Voltage-Max (Vsup): 3.6V
- Terminal Form: BALL
- Number of Terminations: 256
- Pin Count: 256
- Memory Type: EEPROM
- Width: 17mm
- Output Function: MACROCELL
- Height Seated (Max): 1.55mm
- Package / Case: 256-LBGA
- Number of Macro Cells: 384
- Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Number of Gates: 9000
- Series: CoolRunner XPLA3
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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