XC6SLX150-2FGG900IXilinx
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    • Manufacturer No：
      XC6SLX150-2FGG900I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - FPGAs (Field Programmable Gate Array)
    • Datasheet：
      XC6SLX150-2FGG900I
    • SKU：
      5172258
    • Description：
      CMOS 2008 ROHS3Compliant BALL FPGA -40C~100C TJ 603kB 667MHz 1.2V

    User Guide

    User Guide

    XC6SLX150-2FGG900I Details

    CMOS 2008 ROHS3Compliant BALL FPGA -40C~100C TJ 603kB 667MHz 1.2V

    XC6SLX150-2FGG900I Specification Parameters

    • Part Status: Active
    • Speed Grade: 2
    • Mount: Surface Mount
    • Packaging: Tray
    • Qualification Status: Not Qualified
    • Moisture Sensitivity Level (MSL): 3 (168 Hours)
    • Published: 2008
    • Terminal Position: BOTTOM
    • JESD-609 Code: e1
    • Operating Supply Voltage: 1.2V
    • Subcategory: Field Programmable Gate Arrays
    • Peak Reflow Temperature (Cel): 250
    • Width: 31mm
    • Number of Pins: 900
    • Voltage - Supply: 1.14V~1.26V
    • Clock Frequency: 667MHz
    • Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
    • Series: Spartan?-6 LX
    • RAM Size: 603kB
    • Number of Logic Elements/Cells: 147443
    • Number of Registers: 184304
    • RoHS Status: ROHS3 Compliant
    • Mounting Type: Surface Mount
    • Pbfree Code: yes
    • Factory Lead Time: 10 Weeks
    • Technology: CMOS
    • Time@Peak Reflow Temperature-Max (s): 30
    • Terminal Pitch: 1mm
    • Terminal Form: BALL
    • Supply Voltage: 1.2V
    • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
    • Operating Temperature: -40°C~100°C TJ
    • Length: 31mm
    • Number of Terminations: 900
    • Pin Count: 900
    • ECCN Code: 3A991.D
    • Number of I/O: 576
    • Number of Outputs: 570
    • Package / Case: 900-BBGA
    • Total RAM Bits: 4939776
    • Number of LABs/CLBs: 11519
    • Base Part Number: XC6SLX150
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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