XC7K160T-1FFG676CXilinx
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    • Manufacturer No：
      XC7K160T-1FFG676C
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - FPGAs (Field Programmable Gate Array)
    • Datasheet：
      XC7K160T-1FFG676C
    • SKU：
      5172281
    • Description：
      Copper Silver Tin CMOS 2010 ROHS3Compliant FPGA 0C~85C TJ 1.4MB 0.74ns 1098MHz

    User Guide

    User Guide

    XC7K160T-1FFG676C Details

    Copper Silver Tin CMOS 2010 ROHS3Compliant FPGA 0C~85C TJ 1.4MB 0.74ns 1098MHz

    XC7K160T-1FFG676C Specification Parameters

    • Part Status: Active
    • Mounting Type: Surface Mount
    • Radiation Hardening: No
    • Packaging: Tray
    • Technology: CMOS
    • Terminal Pitch: 1mm
    • Terminal Position: BOTTOM
    • Supply Voltage: 1V
    • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
    • Contact Plating: Copper, Silver, Tin
    • Operating Temperature: 0°C~85°C TJ
    • Width: 27mm
    • Number of I/O: 400
    • ECCN Code: 3A991.D
    • Number of Pins: 676
    • Voltage - Supply: 0.97V~1.03V
    • Clock Frequency: 1098MHz
    • Series: Kintex?-7
    • Combinatorial Delay of a CLB-Max: 0.74 ns
    • Height Seated (Max): 3.37mm
    • Number of Logic Elements/Cells: 162240
    • Total RAM Bits: 11980800
    • RoHS Status: ROHS3 Compliant
    • Pbfree Code: yes
    • Surface Mount: YES
    • Factory Lead Time: 10 Weeks
    • Published: 2010
    • HTS Code: 8542.39.00.01
    • Terminal Form: BALL
    • JESD-609 Code: e1
    • Subcategory: Field Programmable Gate Arrays
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • Length: 27mm
    • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    • Number of Outputs: 400
    • Number of Terminations: 676
    • Pin Count: 676
    • Package / Case: 676-BBGA, FCBGA
    • Speed Grade: -1
    • RAM Size: 1.4MB
    • Power Supplies: 11.83.3V
    • Number of LABs/CLBs: 12675
    • Number of Registers: 202800
    • Base Part Number: XC7K160
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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