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  • Manufacturer No:
    XC17S40XLPD8C
  • Manufacturer:
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    Get the PDF file
  • SKU:
    5172822
  • Description:
    XC17S40XL EAR99 Tube 330696X1 ics fpga configuration 7.62mm 0.00005A 400kb 3.3V
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  • Manufacturer No:
    XC17S40XLPD8C
  • Manufacturer:
    Xilinx
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    XC17S40XLPD8C
  • SKU:
    5172822
  • Description:
    XC17S40XL EAR99 Tube 330696X1 ics fpga configuration 7.62mm 0.00005A 400kb 3.3V

XC17S40XLPD8C Details

XC17S40XL EAR99 Tube 330696X1 ics fpga configuration 7.62mm 0.00005A 400kb 3.3V

XC17S40XLPD8C Specification Parameters

  • Surface Mount: NO
  • Number of Functions: 1
  • ECCN Code: EAR99
  • RoHS Status: Non-RoHS Compliant
  • Part Status: Obsolete
  • Number of Terminations: 8
  • Terminal Position: DUAL
  • Supply Voltage: 3.3V
  • Lead Free: Contains Lead
  • Terminal Pitch: 2.54mm
  • Supply Voltage-Min (Vsup): 3V
  • Width: 7.62mm
  • Output Characteristics: 3-STATE
  • Voltage - Supply: 3V~3.6V
  • I/O Type: COMMON
  • Programmable Type: OTP
  • Height Seated (Max): 4.5974mm
  • Memory IC Type: MEMORY CIRCUIT
  • Memory Size: 400kb
  • Base Part Number: XC17S40XL
  • Mounting Type: Through Hole
  • Memory Width: 1
  • Radiation Hardening: No
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Number of Pins: 8
  • Pin Count: 8
  • Packaging: Tube
  • Operating Supply Voltage: 3.3V
  • JESD-609 Code: e0
  • Technology: CMOS
  • Supply Voltage-Max (Vsup): 3.6V
  • Operating Temperature: 0°C~70°C
  • Published: 1999
  • Clock Frequency: 10MHz
  • Package / Case: 8-DIP (0.300, 7.62mm)
  • Supply Current-Max: 0.005mA
  • Standby Current-Max: 0.00005A
  • Length: 9.3599mm
  • Organization: 330696X1
  • Density: 323 kb

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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