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- Manufacturer No：XC7K70T-L2FBG676E
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC7K70T-L2FBG676E
- SKU：5173350
- Description：Kintex®-7 XC7K70T 676-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 2.54mm 1V 0.91ns 607.5kB
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User Guide
XC7K70T-L2FBG676E Details
Kintex®-7 XC7K70T 676-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 2.54mm 1V 0.91ns 607.5kB
XC7K70T-L2FBG676E Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Pbfree Code: yes
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Factory Lead Time: 10 Weeks
- Height Seated (Max): 2.54mm
- Published: 2010
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- JESD-609 Code: e1
- Subcategory: Field Programmable Gate Arrays
- Supply Voltage: 0.9V
- Width: 27mm
- Number of I/O: 300
- ECCN Code: 3A991.D
- Number of Terminations: 676
- Pin Count: 676
- Package / Case: 676-BBGA, FCBGA
- Number of LABs/CLBs: 5125
- Total RAM Bits: 4976640
- Combinatorial Delay of a CLB-Max: 0.91 ns
- Power Supplies: 0.91.83.3V
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Packaging: Tray
- Qualification Status: Not Qualified
- Technology: CMOS
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Operating Supply Voltage: 1V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Length: 27mm
- Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of Outputs: 300
- Operating Temperature: 0°C~100°C TJ
- Number of Pins: 676
- Voltage - Supply: 0.97V~1.03V
- Series: Kintex?-7
- RAM Size: 607.5kB
- Number of Registers: 82000
- Number of Logic Elements/Cells: 65600
- Base Part Number: XC7K70T
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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