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- Manufacturer No：XC7Z020-2CLG400E
- Manufacturer：Xilinx
- Category：Embedded - System On Chip (SoC)
- Datasheet：XC7Z020-2CLG400E
- SKU：5174247
- Description：BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 766MHz 1V
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User Guide
XC7Z020-2CLG400E Details
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 766MHz 1V
XC7Z020-2CLG400E Specification Parameters
- Part Status: Active
- ECCN Code: EAR99
- Surface Mount: YES
- Packaging: Tray
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Height Seated (Max): 1.6mm
- HTS Code: 8542.39.00.01
- Terminal Pitch: 0.8mm
- Supply Voltage: 1V
- JESD-609 Code: e1
- Contact Plating: Copper, Silver, Tin
- Length: 17mm
- Number of I/O: 130
- Number of Terminations: 400
- Architecture: MCU, FPGA
- Operating Temperature: 0°C~100°C TJ
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Series: Zynq?-7000
- RAM (words): 256000
- Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB
- Frequency: 766MHz
- Base Part Number: XC7Z020
- RoHS Status: ROHS3 Compliant
- Radiation Hardening: No
- Boundary Scan: YES
- Factory Lead Time: 10 Weeks
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Published: 2009
- Terminal Position: BOTTOM
- Terminal Form: BALL
- Operating Supply Voltage: 1V
- Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
- Data Bus Width: 32b
- Core Architecture: ARM
- RAM Size: 256kB
- Number of Pins: 400
- Supply Voltage-Max (Vsup): 1.05V
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Peripherals: DMA
- Interface: CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Speed Grade: -2
- Package / Case: 400-LFBGA, CSPBGA
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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