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- Manufacturer No：XC7K160T-L2FFG676E
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC7K160T-L2FFG676E
- SKU：5174598
- Description：Kintex®-7 XC7K160 676-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.37mm 0.91.83.3V 140ps 1.4MB
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XC7K160T-L2FFG676E Details
Kintex®-7 XC7K160 676-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.37mm 0.91.83.3V 140ps 1.4MB
XC7K160T-L2FFG676E Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Pbfree Code: yes
- Packaging: Tray
- Technology: CMOS
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Length: 27mm
- Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of Outputs: 400
- ECCN Code: 3A991.D
- Number of Terminations: 676
- Voltage - Supply: 0.87V~0.93V
- JESD-30 Code: S-PBGA-B676
- RAM Size: 1.4MB
- Number of LABs/CLBs: 12675
- Number of Registers: 202800
- Base Part Number: XC7K160
- Power Supplies: 0.91.83.3V
- Turn On Delay Time: 140 ps
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Radiation Hardening: No
- Factory Lead Time: 10 Weeks
- Published: 2010
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Contact Plating: Copper, Silver, Tin
- Supply Voltage: 0.9V
- Width: 27mm
- Number of I/O: 400
- Number of Inputs: 400
- Operating Temperature: 0°C~100°C TJ
- Pin Count: 676
- Package / Case: 676-BBGA, FCBGA
- Series: Kintex?-7
- Height Seated (Max): 3.37mm
- Number of Logic Elements/Cells: 162240
- Total RAM Bits: 11980800
- Combinatorial Delay of a CLB-Max: 0.91 ns
- Propagation Delay: 140 ps
- Additional Feature: ALSO OPERATES AT 1 V SUPPLY
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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