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- Manufacturer No：XCV300E-6BG352C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XCV300E-6BG352C
- SKU：5174932
- Description：Virtex®-E XCV300E 352-LBGA Exposed Pad Metal Surface Mount field programmable gate array 1.7mm 1.8V 357MHz 0.47ns
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User Guide
XCV300E-6BG352C Details
Virtex®-E XCV300E 352-LBGA Exposed Pad Metal Surface Mount field programmable gate array 1.7mm 1.8V 357MHz 0.47ns
XCV300E-6BG352C Specification Parameters
- Mounting Type: Surface Mount
- Radiation Hardening: No
- Part Status: Obsolete
- Pbfree Code: no
- Speed Grade: 6
- Technology: CMOS
- Number of Outputs: 260
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 1.8V
- Terminal Pitch: 1.27mm
- Terminal Position: BOTTOM
- Published: 2000
- Width: 35mm
- Subcategory: Field Programmable Gate Arrays
- Height Seated (Max): 1.7mm
- RAM Size: 16kB
- ECCN Code: 3A991.D
- Number of Terminations: 352
- Number of LABs/CLBs: 1536
- Series: Virtex?-E
- JESD-30 Code: S-PBGA-B352
- Number of Equivalent Gates: 82944
- Number of Gates: 411955
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Packaging: Tray
- Lead Free: Contains Lead
- JESD-609 Code: e0
- Number of I/O: 260
- Number of Inputs: 260
- Time@Peak Reflow Temperature-Max (s): 30
- Operating Supply Voltage: 1.8V
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Length: 35mm
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Operating Temperature: 0°C~85°C TJ
- Total RAM Bits: 131072
- Voltage - Supply: 1.71V~1.89V
- Pin Count: 352
- Clock Frequency: 357MHz
- Combinatorial Delay of a CLB-Max: 0.47 ns
- Number of Logic Elements/Cells: 6912
- Package / Case: 352-LBGA Exposed Pad, Metal
- Base Part Number: XCV300E
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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