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- Manufacturer No：XCKU060-L1FFVA1156I
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XCKU060-L1FFVA1156I
- SKU：5176651
- Description：2760CLBS Kintex® UltraScale™ 1156-BBGA FCBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 3.51mm 900mV 4.6MB -40C~100C TJ
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XCKU060-L1FFVA1156I Details
2760CLBS Kintex® UltraScale™ 1156-BBGA FCBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 3.51mm 900mV 4.6MB -40C~100C TJ
XCKU060-L1FFVA1156I Specification Parameters
- Part Status: Active
- Packaging: Bulk
- Mount: Surface Mount
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Length: 35mm
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Contact Plating: Copper, Silver, Tin
- Supply Voltage: 0.9V
- Operating Temperature: -40°C~100°C TJ
- Operating Supply Voltage: 900mV
- Number of I/O: 520
- Number of Inputs: 520
- Series: Kintex? UltraScale?
- Voltage - Supply: 0.880V~0.979V
- Number of LABs/CLBs: 41460
- Number of CLBs: 2760
- Number of Registers: 663360
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Packing Method: Tray
- Qualification Status: Not Qualified
- Published: 2012
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
- Width: 35mm
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Power Supplies: 0.9V
- Height Seated (Max): 3.51mm
- ECCN Code: 3A991.D
- Number of Outputs: 520
- Package / Case: 1156-BBGA, FCBGA
- JESD-30 Code: S-PBGA-B1156
- Total RAM Bits: 38912000
- Number of Logic Elements/Cells: 725550
- Organization: 2760 CLBS
- RAM Size: 4.6MB
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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