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  • Manufacturer No:
    XCZU7EV-2FBVB900E
  • Manufacturer:
  • Category:
    Embedded - System On Chip (SoC)
  • Datasheet:
    Get the PDF file
  • SKU:
    5176785
  • Description:
    MCU FPGA Active ROHS3Compliant 2016 System On Chip (SOC) IC 0C~100C TJ 256KB 533MHz 600MHz 1.3GHz
  • Quantity:
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  • Qty Unit Price price
  • 1 $4265.178 $4265.178
  • 10 $4222.948 $42229.48
  • 100 $4181.136 $418113.6
  • 1000 $4139.738 $4139738
  • 10000 $4098.75 $40987500

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  • Manufacturer No:
    XCZU7EV-2FBVB900E
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - System On Chip (SoC)
  • Datasheet:
    XCZU7EV-2FBVB900E
  • SKU:
    5176785
  • Description:
    MCU FPGA Active ROHS3Compliant 2016 System On Chip (SOC) IC 0C~100C TJ 256KB 533MHz 600MHz 1.3GHz

XCZU7EV-2FBVB900E Details

MCU FPGA Active ROHS3Compliant 2016 System On Chip (SOC) IC 0C~100C TJ 256KB 533MHz 600MHz 1.3GHz

XCZU7EV-2FBVB900E Specification Parameters

  • Part Status: Active
  • Pbfree Code: yes
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Published: 2016
  • HTS Code: 8542.31.00.01
  • RAM Size: 256kB
  • Operating Temperature: 0°C~100°C TJ
  • Number of I/O: 204
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
  • Speed: 533MHz, 600MHz, 1.3GHz
  • Series: Zynq? UltraScale+? MPSoC EV
  • RoHS Status: ROHS3 Compliant
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Packaging: Tray
  • Factory Lead Time: 11 Weeks
  • Moisture Sensitivity Level (MSL): 4 (72 Hours)
  • Architecture: MCU, FPGA
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Package / Case: 900-BBGA, FCBGA
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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