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- Manufacturer No：XCF32PFS48C
- Manufacturer：Xilinx
- Category：Memory - Configuration Proms for FPGAs
- Datasheet：XCF32PFS48C
- SKU：5176877
- Description：XCF*P Tin/Lead (Sn63Pb37) EAR99 Tray ics fpga configuration 8mm 0.04mA 32Mb 1.8V
User Guide
User Guide
XCF32PFS48C Details
XCF*P Tin/Lead (Sn63Pb37) EAR99 Tray ics fpga configuration 8mm 0.04mA 32Mb 1.8V
XCF32PFS48C Specification Parameters
- Part Status: Active
- Number of Functions: 1
- ECCN Code: EAR99
- Surface Mount: YES
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Operating Temperature: -40°C~85°C
- Lead Free: Contains Lead
- JESD-609 Code: e0
- Data Retention Time-Min: 20
- Factory Lead Time: 13 Weeks
- Operating Supply Voltage: 1.8V
- Number of Terminations: 48
- Pin Count: 48
- Terminal Position: BOTTOM
- Height Seated (Max): 1.2mm
- Width: 8mm
- Length: 9mm
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Supply Voltage-Min (Vsup): 1.65V
- Programmable Type: In System Programmable
- Subcategory: Flash Memories
- Memory Size: 32MB
- Voltage - Supply: 1.65V~2V
- Package / Case: 48-TFBGA, CSPBGA
- Base Part Number: XCF*P
- Mounting Type: Surface Mount
- Memory Width: 1
- RoHS Status: Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Packaging: Tray
- Pbfree Code: no
- Qualification Status: Not Qualified
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 1.8V
- Reach Compliance Code: not_compliant
- Number of Pins: 48
- Supply Voltage-Max (Vsup): 2V
- Terminal Pitch: 0.8mm
- Terminal Form: BALL
- Published: 1999
- Parallel/Serial: SERIAL
- Operating Mode: SYNCHRONOUS
- HTS Code: 8542.32.00.51
- Supply Current-Max: 0.04mA
- Memory Density: 33554432 bit
- Memory IC Type: CONFIGURATION MEMORY
- Organization: 32MX1
- Endurance: 20000 Write/Erase Cycles
- Additional Feature: IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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