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- Manufacturer No：XC7VX330T-3FFG1761E
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC7VX330T-3FFG1761E
- SKU：5176965
- Description：Virtex®-7XT XC7VX330T 1760-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.5mm 11.8V 1818MHz 90ps
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XC7VX330T-3FFG1761E Details
Virtex®-7XT XC7VX330T 1760-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.5mm 11.8V 1818MHz 90ps
XC7VX330T-3FFG1761E Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Radiation Hardening: No
- Packaging: Tray
- Technology: CMOS
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Supply Voltage: 1V
- Height Seated (Max): 3.5mm
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Length: 42.5mm
- ECCN Code: 3A991.D
- Package / Case: 1760-BBGA, FCBGA
- Voltage - Supply: 0.97V~1.03V
- RAM Size: 3.3MB
- Series: Virtex?-7 XT
- Number of Inputs: 650
- Pin Count: 1761
- Speed Grade: -3
- Turn On Delay Time: 90 ps
- Number of LABs/CLBs: 25500
- Number of Registers: 408000
- Base Part Number: XC7VX330T
- RoHS Status: ROHS3 Compliant
- Pbfree Code: yes
- Surface Mount: YES
- Factory Lead Time: 10 Weeks
- Published: 2010
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- JESD-609 Code: e1
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Contact Plating: Copper, Silver, Tin
- Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Width: 42.5mm
- Operating Temperature: 0°C~100°C TJ
- Number of I/O: 700
- Power Supplies: 11.8V
- Clock Frequency: 1818MHz
- Number of Outputs: 650
- Number of Terminations: 1761
- Combinatorial Delay of a CLB-Max: 0.58 ns
- Propagation Delay: 90 ps
- JESD-30 Code: S-PBGA-B1761
- Number of Logic Elements/Cells: 326400
- Total RAM Bits: 27648000
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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