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  • Manufacturer No:
    XC4VSX55-12FFG1148C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC4VSX55-12FFG1148C
  • SKU:
    5176975
  • Description:
    Copper Silver Tin CMOS 1999 ROHS3Compliant FPGA 0C~85C TJ 720kB 1.2V 3.4mm

XC4VSX55-12FFG1148C Details

Copper Silver Tin CMOS 1999 ROHS3Compliant FPGA 0C~85C TJ 720kB 1.2V 3.4mm

XC4VSX55-12FFG1148C Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Pbfree Code: yes
  • Factory Lead Time: 10 Weeks
  • Technology: CMOS
  • Speed Grade: 12
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • JESD-609 Code: e1
  • Operating Supply Voltage: 1.2V
  • Length: 35mm
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Peak Reflow Temperature (Cel): 245
  • Moisture Sensitivity Level (MSL): 4 (72 Hours)
  • Operating Temperature: 0°C~85°C TJ
  • ECCN Code: 3A991.D
  • Number of I/O: 640
  • Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Number of Logic Elements/Cells: 55296
  • JESD-30 Code: S-PBGA-B1148
  • RAM Size: 720kB
  • Base Part Number: XC4VSX55
  • RoHS Status: ROHS3 Compliant
  • Mount: Surface Mount
  • Packaging: Tray
  • Qualification Status: Not Qualified
  • Time@Peak Reflow Temperature-Max (s): 30
  • Reach Compliance Code: not_compliant
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Supply Voltage: 1.2V
  • Published: 1999
  • Width: 35mm
  • Subcategory: Field Programmable Gate Arrays
  • Contact Plating: Copper, Silver, Tin
  • Height Seated (Max): 3.4mm
  • Voltage - Supply: 1.14V~1.26V
  • Number of Outputs: 640
  • Number of Inputs: 640
  • Number of LABs/CLBs: 6144
  • Package / Case: 1148-BBGA, FCBGA
  • Series: Virtex?-4 SX
  • Total RAM Bits: 5898240

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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