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  • Manufacturer No:
    XC17S200APDG8C
  • Manufacturer:
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    Get the PDF file
  • SKU:
    5176985
  • Description:
    XC17S200A Matte Tin (Sn) EAR99 Tube ics fpga configuration 7.62mm 0.001A 2Mb 3.3V
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  • Manufacturer No:
    XC17S200APDG8C
  • Manufacturer:
    Xilinx
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    XC17S200APDG8C
  • SKU:
    5176985
  • Description:
    XC17S200A Matte Tin (Sn) EAR99 Tube ics fpga configuration 7.62mm 0.001A 2Mb 3.3V

XC17S200APDG8C Details

XC17S200A Matte Tin (Sn) EAR99 Tube ics fpga configuration 7.62mm 0.001A 2Mb 3.3V

XC17S200APDG8C Specification Parameters

  • Surface Mount: NO
  • Mounting Type: Through Hole
  • Memory Width: 1
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Part Status: Obsolete
  • Number of Terminations: 8
  • Terminal Position: DUAL
  • Supply Voltage: 3.3V
  • Terminal Pitch: 2.54mm
  • Terminal Finish: Matte Tin (Sn)
  • Supply Voltage-Min (Vsup): 3V
  • Width: 7.62mm
  • Output Characteristics: 3-STATE
  • Voltage - Supply: 3V~3.6V
  • I/O Type: COMMON
  • Peak Reflow Temperature (Cel): 250
  • Supply Current-Max: 0.015mA
  • Memory Size: 2MB
  • Memory IC Type: CONFIGURATION MEMORY
  • Base Part Number: XC17S200A
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Number of Functions: 1
  • RoHS Status: RoHS Compliant
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Number of Pins: 8
  • Pin Count: 8
  • Packaging: Tube
  • Operating Supply Voltage: 3.3V
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Supply Voltage-Max (Vsup): 3.6V
  • Operating Temperature: 0°C~70°C
  • Published: 1999
  • Parallel/Serial: SERIAL
  • Package / Case: 8-DIP (0.300, 7.62mm)
  • Programmable Type: OTP
  • Height Seated (Max): 4.5974mm
  • Standby Current-Max: 0.001A
  • Length: 9.3599mm

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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