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- Manufacturer No：XC6VLX195T-L1FFG784C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC6VLX195T-L1FFG784C
- SKU：5177432
- Description：Virtex®-6LXT XC6VLX195T 784-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.1mm 900mV 1098MHz 5.87ns
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User Guide
XC6VLX195T-L1FFG784C Details
Virtex®-6LXT XC6VLX195T 784-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.1mm 900mV 1098MHz 5.87ns
XC6VLX195T-L1FFG784C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Pbfree Code: yes
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Published: 2008
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 245
- Height Seated (Max): 3.1mm
- Supply Voltage: 0.9V
- Width: 29mm
- Number of I/O: 400
- Operating Supply Voltage: 900mV
- Voltage - Supply: 0.87V~0.93V
- Pin Count: 784
- RAM Size: 1.5MB
- Clock Frequency: 1098MHz
- Power Supplies: 11.2/2.5V
- Combinatorial Delay of a CLB-Max: 5.87 ns
- Total RAM Bits: 12681216
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Packaging: Tray
- Qualification Status: Not Qualified
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Operating Temperature: 0°C~85°C TJ
- Length: 29mm
- Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of Outputs: 400
- ECCN Code: 3A991.D
- Number of Terminations: 784
- Number of Pins: 784
- Package / Case: 784-BBGA, FCBGA
- Series: Virtex?-6 LXT
- Number of LABs/CLBs: 15600
- Number of Logic Elements/Cells: 199680
- Base Part Number: XC6VLX195T
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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