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- Manufacturer No：XCR3256XL-10CS280I
- Manufacturer：Xilinx
- Category：Embedded - CPLDs (Complex Programmable Logic Devices)
- Datasheet：XCR3256XL-10CS280I
- SKU：5177450
- Description：YES 280-TFBGA CSPBGA 2003 CoolRunner XPLA3 complex programmable logic device 105MHz 1.2mm 9.1ns 2.7V~3.6V
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User Guide
XCR3256XL-10CS280I Details
YES 280-TFBGA CSPBGA 2003 CoolRunner XPLA3 complex programmable logic device 105MHz 1.2mm 9.1ns 2.7V~3.6V
XCR3256XL-10CS280I Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- RoHS Status: Non-RoHS Compliant
- JTAG BST: YES
- Supply Voltage: 3.3V
- Pbfree Code: no
- Qualification Status: Not Qualified
- Number of Logic Elements/Blocks: 16
- Speed Grade: 10
- Time@Peak Reflow Temperature-Max (s): 30
- Operating Temperature: -40°C~85°C TA
- Supply Voltage-Max (Vsup): 3.6V
- Terminal Pitch: 0.8mm
- Height Seated (Max): 1.2mm
- Peak Reflow Temperature (Cel): 240
- Voltage Supply - Internal: 2.7V~3.6V
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Output Function: MACROCELL
- Number of Gates: 6000
- Number of Pins: 280
- Number of Terminations: 280
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max: 9.1ns
- Packaging: Bulk
- ECCN Code: EAR99
- Surface Mount: YES
- Additional Feature: YES
- Operating Supply Voltage: 3.3V
- Factory Lead Time: 10 Weeks
- JESD-609 Code: e0
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Reach Compliance Code: not_compliant
- HTS Code: 8542.39.00.01
- Terminal Position: BOTTOM
- Published: 2003
- Terminal Form: BALL
- Number of Macro Cells: 256
- Memory Type: EEPROM
- Propagation Delay: 10 ns
- Subcategory: Programmable Logic Devices
- Number of I/O: 164
- Pin Count: 280
- Max Frequency: 105MHz
- Series: CoolRunner XPLA3
- Package / Case: 280-TFBGA, CSPBGA
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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