XC6VLX365T-2FF1156IXilinx
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    • Manufacturer No：
      XC6VLX365T-2FF1156I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - FPGAs (Field Programmable Gate Array)
    • Datasheet：
      XC6VLX365T-2FF1156I
    • SKU：
      5177731
    • Description：
      CMOS 2008 Non-RoHS Compliant BALL FPGA -40C~100C TJ 1.8MB 1V 3.5mm

    User Guide

    User Guide

    XC6VLX365T-2FF1156I Details

    CMOS 2008 Non-RoHS Compliant BALL FPGA -40C~100C TJ 1.8MB 1V 3.5mm

    XC6VLX365T-2FF1156I Specification Parameters

    • Part Status: Active
    • Mounting Type: Surface Mount
    • RoHS Status: Non-RoHS Compliant
    • Peak Reflow Temperature (Cel): NOT SPECIFIED
    • Pbfree Code: no
    • Qualification Status: Not Qualified
    • Technology: CMOS
    • Terminal Pitch: 1mm
    • Terminal Form: BALL
    • Operating Supply Voltage: 1V
    • Length: 35mm
    • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • Operating Temperature: -40°C~100°C TJ
    • Number of Outputs: 600
    • Voltage - Supply: 0.95V~1.05V
    • Package / Case: 1156-BBGA, FCBGA
    • Series: Virtex?-6 LXT
    • Number of LABs/CLBs: 28440
    • Base Part Number: XC6VLX365T
    • Speed Grade: 2
    • Mount: Surface Mount
    • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
    • Packaging: Tray
    • Factory Lead Time: 10 Weeks
    • JESD-609 Code: e0
    • Published: 2008
    • Terminal Position: BOTTOM
    • Supply Voltage: 1V
    • Height Seated (Max): 3.5mm
    • Width: 35mm
    • Subcategory: Field Programmable Gate Arrays
    • Terminal Finish: Tin/Lead (Sn63Pb37)
    • Number of I/O: 600
    • ECCN Code: 3A991.D
    • Number of Pins: 1156
    • RAM Size: 1.8MB
    • Total RAM Bits: 15335424
    • Number of Logic Elements/Cells: 364032
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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